材料介绍表
产品系列 特点 典型应用 代表牌号
高纯系列 以高性能弹性体(FFKM)为主材料，具有卓越的化学稳定性和高洁净性；极强的等离子体耐受力；且在制造过程中经过严格 净化，不含无机填充剂；极低的金属离子含量，无微尘颗粒析 出，可避免污染敏感环境。 半导体制造相关制程(Etch、PVD、CVD、Cleaning、Stripping等)中与腔 体有接触，需要高洁净度、强等离子耐 受力的密封圈、阀门等关键部件。 0010、1113、1115
耐高温系列 以高性能弹性体(FFKM)为主材料，具有卓越的化学稳定性和较高的洁净性；极强的等离子体耐受力；选用纯洁度极高的填 充材料，配以独创性的加工技术，大大提升了材料在极端高温 下的耐受力，最高使用温度可达325°℃。 半导体制造相关制程(Etch、PVD、CVD、Cleaning、Stripping等)中与高 温接触的密封圈、阀门等关键部件。 1014B、1014D、1111
耐化系列 以高性能弹性体(FFKM)为主材料，具有卓越的化学稳定性和高洁净性；极强的等离子体耐受力；独特的有机填料添加技术，使之耐化学品腐蚀、等离子体冲击方面具有更优越的表 现。 半导体制造相关制程(Etch、PVD、CVD、Cleaning、Stripping等)中与各 种化学品接触及受等离子体冲击的密 封圈、阀门等关键部件。 1011B、1020A
耐磨系列 以高性能弹性体(FFKM/FKM)为主材料，具有卓越的化学稳 定性和高洁净性；极强的等离子体耐受力；配以卓越的混炼技 术，提升材料的机械性能，能够承受高压力和频繁的机械运动，具有良好的弹性和耐磨性，适合长期使用，减少因磨损产 生的颗粒污染。 半导体制造相关制程(Etch、PVD、CVD、Cleaning、Stripping等)中与移 动、往复运动等关联的密封材料。 1190、1014B
Product Series Features Typical Applications Representaive Grades
High Purity Series Using high-performance elastomer(FFKM)asthe main material,it has excellent chemical stability and high cleanliness;extremely strong plasmaendurance;and is strictly purified during manufacturing,free of inorganic fillers;extremely low metal ion content,no micro dust particles released,can avoid polluting sensitive environments. Key components such as seals and valves that are in contact with the chamber in semiconductor manufacturing related processes (Etch,PVD,CVD,Cleaning,Stripping, etc.)require high cleanliness and strong plasma tolerance. 0010、1113、1115
High Temperature Resistance Series Using high-performance elastomer (FFKM)as the main material,it has excellent chemical stability and relatively high cleanliness;extremely strong plasma endurance; made with extremely pure fillers and proprietary processing technology,greatly enhancing the material's endurance under extreme high temperatures,with a maximum operating temperature ofup to 325°℃. Key components such as seals and valves that come into contact with high temperatures in semiconduc- tor manufacturing related processes(Etch,PVD,CVD, Cleaning,Stripping,etc.). 1014B、1014D、1111
Chemical Resistance Series Using high-performance elastomer (FFKM)as the main material,it has excellent chemical stability and high cleanliness;extremely strong plasma endurance;unique organic filler addition technology gives it superior performance in resisting chemical corrosion and plasma. Key components such as seals and valves that come into contact with various chemicals and are impacted by plasma in semicon- ductor manufacturing related processes(Etch,PVD,CVD, Cleaning,Stripping,etc.). 1011B、1020A
Wear Resistance Series Using high-performance elastomer (FFKM/FKM)as the main material,it has excellent chemical stability and high cleanliness;extremely strong plasma endurance;with outstanding compounding technology,improving the material's mechanical properties,able to withstand high pressure and frequent mechanical movements,has good elasticity and wear resistance,suitable for long-term use, reducing particle pollution caused by wear. Sealing materials associated with movement,reciprocating motion, etc.in semiconductormanufactur- ing related processes(Etch,PVD, CVD,Cleaning,Stripping,etc.). 1190、1014B