广泛应用于半导体干法蚀刻腔体,通过调节板阀的开度可精准控制抽气速度。
在设备运行过程中,密封圈(lock ring)与调节板阀接触面因摩擦作用产生横向剪切力,易引发结构断裂及部件脱落问题,本公司研发的密封圈(lock ring)具有极强的耐摩擦能力,可有效消除此类机械失效风险。
Widely used in semiconductor dry etching chambers, the exhaust rate is accurate-ly controlled by adjusting the opening of the plate vave.
During the operation of the equipment, the contact surface between the sealing ring(lock ring) and the regulating plate vave generates lateral shear force due to friction, which can easily cause structural fracture and component falling off.The sealing fing (lock ring)developed by our company has extremely strong fiction resistance and can effectively eliminate the risk of such mechanical failure.
设计特点及优势
Design Features and Advantages
1
使用超洁净的、耐等离子体、极低金属离子溶出、具有超强耐磨性的材料。
Use ultra-clean, plasma-resistant,extremely low metal ion dissolution and super wear-resistant materials.
2
精准的尺寸设计。
Precision Dimensional Design.
3
使用寿命延长一倍
Double the service life.
序号 量产清单
1 CS-OR-T091839-510-0010
2 CS-OR-T102863-016-0010厚
3 CS-OR-T102863-016-0010薄D-DEMO
4 CS-OR-T019090-374-1113
5 CS-OR-T019090-328-1113_DEMO
6 CS-OR-T019090-328-1113A_DEMO
7 CS-OR-T019090-328-0012
8 CS-OR-T102863-077-6068_DEMO
9 CS-OR-T019090-374-0013薄
10 CS-OR-T102863-111-0010