广泛应用于半导体晶圆制造传输领域，解决移动晶圆时晶圆晃动、晶圆掉落、O型密封圈从机械臂上掉落，损伤晶圆问题，避免粘片、滑片，具有耐等离子体、耐酸碱、耐高温等优势。
Widely used in the field of semiconductor wafer manufacture transmission.It solves the problems of wafer jitter,wafer falling,robot arm O-ring falling,wafer damage,etc.when the wafer is moved,avoids wafer adhesion and slipping,and has the advantages of plasma resistance,acid and alkali resistance,and high tem-perature resistance.
设计特点及优势
Design Features and Advantages
1
使用耐摩擦、耐等离子体、极低金属离子溶出的材料，确保在先进制造工艺的可靠性。
Utilize materials exhibiting wear resistance,plasma resistance,and extremely low metal ion leaching to ensure reliability in advanced manufacturing processes.
2
精准的尺寸测量和结构设计，安装后不易变形、掉落；
Precision dimensional measurement and structural design ensure that it is not easy to deform or falloff after installation.
序号 量产清单
1 CS-OR-T091839-510-0010
2 CS-OR-T102863-016-0010厚
3 CS-OR-T102863-016-0010薄D-DEMO
4 CS-OR-T019090-374-1113
5 CS-OR-T019090-328-1113_DEMO
6 CS-OR-T019090-328-1113A_DEMO
7 CS-OR-T019090-328-0012
8 CS-OR-T102863-077-6068_DEMO
9 CS-OR-T019090-374-0013薄
10 CS-OR-T102863-111-0010